• High-speed solder printing capability: 

    - 10* sec/cycle

    - 12* sec/cycle including cleaning.

       * standard printing: under optimum condition, including board transfer time and printing time

  • Wet print accuracy: ±25 μm ( 6σ )

  • Positioning repeat-ability accuracy: ±10 μm ( 6σ )

  • Stencils up to L 750 x  W 750 mm

  • Printing head information:

    - 3S head ( 3S = Swing Single Squeezee )

    - Squeegee speed: 2 to 200 mm/sec

    - Squeegee pressing force: 5 to 200 N +/- 2N ( feedback control )

    - Squeegee variable printing attack angle: 45 to 65 degree 

    - Squeegee blade material: Metal or Urethane


  • Options:

    - 2D print inspection camera

    - right-to-left transport

    - PCB vacuum system

    - UPS system

    - PSC system (PSC: Print Stability Control) 

    - Temperature control unit

    - Solder remaining quantity

    - Automatic stencil exchange

    - Automatic push-up pin exchange function

    - Automatic solder transfer function

    - Applicable PCB: L 610 x W 510 mm

    - Software: YAMAHA Factory Tools


  • Machine size:  with conveyor: L 1.640 mm x W 1.990 mm x H 1.525 mm

  • Machine weigh: 1.700 kg